Polyurethane polishing pads
Foamed cured polyurethane with a closed-cell structure; wear resistant, efficient and dimensionally stable for rough polishing.
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CMP Polishing Pads
Three pad structures form an independent line for rough, fine and surface polishing of wafers, substrates and optical materials.
PRODUCT LINE 02 · CMP
CMPCMP polishing pads
Polyurethane, nonwoven and suede-type nonwoven pads selected by workpiece, polishing stage, equipment and target metrics.
Nonwoven polishing pads
Permeable polymer-fibre structure with configurable microstructure for fine polishing processes.
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Suede-type nonwoven polishing pads
Lower hardness, higher compression and good elasticity to improve roughness and within-wafer uniformity.
Learn moreRough polishingFine polishingGroove patternHardness & compressionEquipment fitSample validation
PROCESS VALIDATION
Polishing tests and equipment fit
Review platen size, operating conditions, polishing stage and surface targets; validate with samples when required.
Rough polishingFine polishingGroove patternHardness & compressionEquipment fitSample validation
PRODUCTION & LAB
Production and laboratory facilities
Our wet-laid nonwoven production line, surface-finishing equipment, polishing laboratory and inspection laboratory support material preparation, processing and performance validation.
- Polyurethane pad production
- Nonwoven polishing pad production
- R&D and inspection labs
- Polishing equipment and validation
Need a pad matched to your process?
Send the workpiece, equipment, polishing stage and target results for a technical recommendation.