N-type Conductive SiC Substrates

4H, nitrogen-doped, 0.015–0.025 ohm·cm. 4 / 6 / 8 / 12 inch, double-side polished.

4H-SiC4–12 inchUltra-P · Production · Dummy
  • 4H-SiC
  • Double-side polished (Si face / C face)
  • Ultra-P / Production / Dummy
  • Nitrogen-filled / vacuum packaging
  • Epi-ready

N-type single-crystal silicon carbide substrates are the base material for power devices — MOSFETs and Schottky diodes used in traction inverters, charging stations, PV and energy-storage converters. Supplied in three grades: Ultra-P, Production and Dummy.

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N-type Conductive SiC SubstratesN-type Conductive SiC Substrates

Technical specifications

SizeGradeDiameterThicknessKey specification
4 inchProduction / Dummy100.0 mm≈350 μm4H, nitrogen doped
6 inchUltra-P150.0 ± 0.2 mm350 ± 25 μmMicropipe <0.1 /cm², TSD ≤10 /cm², TUA ≥98 %
6 inchProduction150.0 ± 0.2 mm350 ± 25 μmMicropipe <0.2 /cm², TTV ≤5 μm, TUA ≥95 %
6 inchDummy150.0 ± 0.2 mm350 ± 25 μmMicropipe <10 /cm², process dummy
8 inchUltra-P200.0 ± 0.2 mm350 / 500 ± 25 μmMicropipe <0.1 /cm², LTV ≤2 μm, TTV ≤5 μm
8 inchProduction200.0 ± 0.2 mm350 / 500 ± 25 μmMicropipe <0.5 /cm², TTV ≤10 μm, TUA ≥95 %
8 inchDummy200.0 ± 0.2 mm350 / 500 ± 25 μmMicropipe <50 /cm², process dummy
12 inchEngineering sample300.0 ± 0.5 mm700 ± 50 μmSi-face CMP, notch orientation
As-cutper substrate grade4 / 6 / 8 inchon requestSliced wafers, unpolished

Typical parameters shown. Exact values per current technical specification; custom specs available.

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