SHANGHAI SHENGDI SEMICONDUCTOR
SiC MATERIALS · GLOBAL ENGINEERING SUPPLY

Silicon carbide,
from crystal to substrate

We supply SiC substrates, optical wafers, ingots, seed crystals, powder and CMP polishing pads—with specification review, sample validation and reliable delivery.

  • 4–12 inch
  • N-type / HPSI
  • Batch documentation
SiCDouble-side polished SiC substrates
4–12″Substrate sizes
N-type · HPSICore materials
Sample → BatchSupply path
CORE PORTFOLIO · SiC

SiC materials portfolio

From finished substrates to upstream crystal materials, selected by application, specification and grade.

N-type Conductive SiC Substrates

N-type Conductive SiC Substrates

N-type 4H-SiC double-side polished substrates in 4–12 inch sizes.

  • 4H-SiC
  • 4 / 6 / 8 / 12″
  • N-type
Details
Semi-Insulating SiC Substrates & Optical Wafers

Semi-Insulating SiC Substrates & Optical Wafers

High-purity semi-insulating SiC and optical wafers for RF and optical applications.

  • HPSI 4H
  • 4 / 6 / 8″
  • Optical
Details
Ingots, Seed Crystals, Powder & Moissanite

Ingots, Seed Crystals, Powder & Moissanite

Ingots, seed crystals and powder for crystal growth and materials research.

  • Ingot · Seed
  • CVD powder
  • A / B / C / R
Details
PRODUCT LINE 02 · CMP

CMP polishing pads

Polyurethane, nonwoven and suede-type nonwoven pads selected by workpiece, polishing stage, equipment and target metrics.

CMP
Polyurethane polishing pads

Polyurethane polishing pads

Foamed cured polyurethane with a closed-cell structure; wear resistant, efficient and dimensionally stable for rough polishing.

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Nonwoven polishing pads

Nonwoven polishing pads

Permeable polymer-fibre structure with configurable microstructure for fine polishing processes.

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Suede-type nonwoven polishing pads

Suede-type nonwoven polishing pads

Lower hardness, higher compression and good elasticity to improve roughness and within-wafer uniformity.

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WORKING PROCESS

Three steps from request to delivery

Technical confirmation comes before quotation to reduce unnecessary iterations.

01

Submit specification

Size, grade, quantity and application

02

Technical review

Parameters, documents and sample path

03

Delivery execution

Packing, logistics and traceability

Specification, validation and lot delivery
QUALITY & DELIVERY

Specification, validation and lot delivery

We confirm product family, size, grade, key metrics and documentation from the application before samples or volume supply.

  • Use, size, grade and volume
  • Key parameters, inspection and files
  • On-tool testing and feedback
  • Quotation, lead time and records
Illustrative SiC production scene

Need a price, a specification or samples?

Tell us the size, grade and quantity — we will prepare a technical and commercial proposal.

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Request a quote